产品特点：
1. 概述主要用于对表面有油污的单/多晶硅片进行超声波振荡清洗.
2. 组成设备基本由六-十个清洗槽构成。
3. 控制设备操作方便,清洗工作过程带时间控制.
4. 装片每槽可装载多个花篮，晶片放在清洗花篮内（25片/篮）。
5.超声波振荡清洗过程水温可根据需要设置加热管,清洗功率与超声频率可根据需要调整.
6. 槽体材料可选用PTFE、PVDF、PP和不锈钢等.
7. PLC控制，触摸屏操作面板.
8. 多种工作模式：全自动、半自动、手动等.
9. 实时状态显示及故障报警
Product features：
1. Summary mainly for useing ultrasonic cleaning oscillation to wash the single / polysilicon has oil on the surface.
2. This Equipment was composed by 6- 10 cleaning groove.
3. Control equipment is easy to operate, and the washing process has the Time Control
4. Every tank can Loading more baskets which has Chip in(25/basket)
5. The water temperature of cleaning process can be set up heating pipe according to the request, Ultrasonic
cleaning power and frequency may need to be adjusted.
6. Groove material may choose to use PTFE, PVDF, PP and stainless steel, etc.
7. PLC control, and touch screen operation panel
8. Multiple operating modes: automatic, semi-automatic, manual, etc.
9. Real-time status display and Failure Alarm
适用范围：太阳能硅片，半导体，电子零件等。
Scope： Solar wafers, semiconductor, electronics and other industries.
