The PowerFLAT™ 8x8 HV is a new high-performance 1 mm-high surface mount fully molded power package featuring a bottom exposed metal drain pad for efficient heat dissipation and improved thermal performance. Its low profile enables designers to achieve more compact designs for applications such as laptop power adapters, LCDs, lighting ballasts, telecom power equipment and solar micro-inverters. It can house the same maximum silicon die size as a TO-220 within a leadless 8 x 8 mm outline. The first device available in this new package option is the 650 V, 190 mΩ STL21N65M5 power MOSFET based on ST’s MDmesh™ V technology. The new package’s compact form factor and high thermal performance, combined with the unequalled low RDS(on) per die area of ST’s MDmesh V technology, maximize power density and save PCB space.
Features
Maximum thickness: 1 mm
Unequalled low RDS(on) x area
Creepage distance: 2.7 mm
Lead finishing: pure tin plating (Sn 100%)
Operating Tj between -55 and +150 °C
Halogen free
RoHS compliant
MSL level 1
Suited for wave soldering
Provided in 13” tape and reel
Benefits
Compactness
Higher power density
Reliability
High thermal performance, Rthj-amb = 45 °C/W (similar to D2PAK)
Increased efficiency in switching applications
Applications
Laptop power adapters
LCDs
Lighting ballasts
Telecom power equipment
Solar micro-inverters
